3D IC Stacking Technology by Banqiu Wu
English | July 7, 2011 | ISBN: 007174195X | 544 Pages | EPUB | 11 MB
With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.