3D Stacked Chips

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems  eBooks & eLearning

Posted by Underaglassmoon at May 13, 2016
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Springer | Circuits & Systems | June 12, 2016 | ISBN-10: 3319204807 | 339 pages | pdf | 16.3 mb

Editors: Elfadel, Ibrahim (Abe) M., Fettweis, Gerhard (Eds.)
Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems;
Explains the use of wireless 3D integration to improve 3D IC reliability and yield;
Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
Includes discussion of 3D integration of high-density power sources and novel NVM

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs [Repost]  eBooks & eLearning

Posted by ChrisRedfield at Sept. 23, 2014
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs [Repost]

Brandon Noia, Krishnendu Chakrabarty - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published: 2013-12-02 | ISBN: 3319023772 | PDF | 274 pages | 6 MB

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs  eBooks & eLearning

Posted by nebulae at Jan. 22, 2014
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Brandon Noia, Krishnendu Chakrabarty, "Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs"
English | ISBN: 3319023772 | 2014 | 274 pages | PDF | 7 MB

3D Flash Memories  eBooks & eLearning

Posted by Underaglassmoon at June 1, 2016
3D Flash Memories

3D Flash Memories
Springer | Hardware | June 27, 2016 | ISBN-10: 9401775109 | 380 pages | pdf | 25.18 mb

Editors: Micheloni, Rino (Ed.)
The first book to focus on 3D flash memories
Provides details of flash 3D architectures which have never been published before, including a number of 3D cross sections
Offers unique coverage of flash with Through-Silicon-Via (TSV) technology

Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)  eBooks & eLearning

Posted by Specialselection at Jan. 18, 2013
Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)

"Mobile 3D Graphics SoC: From Algorithm to Chip"
Hoi-Jun Yoo, Jeong-Ho Woo, Ju-Ho Sohn, Byeong-Gyu Nam

English | 2010-03-01 | ISBN: 0470823771 | 342 pages | PDF | 6.2 mb

Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)  eBooks & eLearning

Posted by arundhati at June 5, 2012
Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)

Hoi-Jun Yoo, Jeong-Ho Woo, "Mobile 3D Graphics SoC: From Algorithm to Chip"
2010 | ISBN-10: 0470823771 | PDF | 352 pages | 6,2 MB

Mobile 3D Graphics SoC: From Algorithm to Chip  eBooks & eLearning

Posted by tot167 at Aug. 18, 2010
Mobile 3D Graphics SoC: From Algorithm to Chip

Hoi-Jun Yoo, Jeong-Ho Woo, Ju-Ho Sohn, and Byeong-Gyu Nam, "Mobile 3D Graphics SoC: From Algorithm to Chip"
Wiley | 2010 | ISBN: 0470823771 | 352 pages | PDF | 6,5 MB

Vertical 3D Memory Technologies (repost)  eBooks & eLearning

Posted by arundhati at Dec. 23, 2016
Vertical 3D Memory Technologies (repost)

Betty Prince, "Vertical 3D Memory Technologies"
English | 2014 | ISBN: 1118760514 | 368 pages | PDF | 6 MB

Vertical 3D Memory Technologies  eBooks & eLearning

Posted by Bayron at Sept. 7, 2014
Vertical 3D Memory Technologies

Vertical 3D Memory Technologies by Betty Prince
English | 2014 | ISBN: 1118760514 | 368 pages | PDF | 6,4 MB

Lynda - AutoCAD Plant 3D Essential Training: Specs & Catalogs  eBooks & eLearning

Posted by U.N.Owen at July 19, 2017
Lynda - AutoCAD Plant 3D Essential Training: Specs & Catalogs

Lynda - AutoCAD Plant 3D Essential Training: Specs & Catalogs
Size: 368 MB | Duration: 1h 45m | Video: AVC (.mp4) 1280x720 30fps | Audio: AAC 48KHz 2ch
Genre: eLearning | Level: Beginner | Language: English

How do specifications and catalogs work together, and how can you streamline your piping model designs? This course covers how to use AutoCAD Plant 3D to create a new spec and build contents by leveraging catalog components.