3D Stacked Chips

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems  eBooks & eLearning

Posted by Underaglassmoon at May 13, 2016
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

Springer | Circuits & Systems | June 12, 2016 | ISBN-10: 3319204807 | 339 pages | pdf | 16.3 mb

Editors: Elfadel, Ibrahim (Abe) M., Fettweis, Gerhard (Eds.)
Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems;
Explains the use of wireless 3D integration to improve 3D IC reliability and yield;
Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
Includes discussion of 3D integration of high-density power sources and novel NVM

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs [Repost]  eBooks & eLearning

Posted by ChrisRedfield at Sept. 23, 2014
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs [Repost]

Brandon Noia, Krishnendu Chakrabarty - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published: 2013-12-02 | ISBN: 3319023772 | PDF | 274 pages | 6 MB

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs  eBooks & eLearning

Posted by nebulae at Jan. 22, 2014
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Brandon Noia, Krishnendu Chakrabarty, "Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs"
English | ISBN: 3319023772 | 2014 | 274 pages | PDF | 7 MB

3D Flash Memories  eBooks & eLearning

Posted by Underaglassmoon at June 1, 2016
3D Flash Memories

3D Flash Memories
Springer | Hardware | June 27, 2016 | ISBN-10: 9401775109 | 380 pages | pdf | 25.18 mb

Editors: Micheloni, Rino (Ed.)
The first book to focus on 3D flash memories
Provides details of flash 3D architectures which have never been published before, including a number of 3D cross sections
Offers unique coverage of flash with Through-Silicon-Via (TSV) technology

Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)  eBooks & eLearning

Posted by Specialselection at Jan. 18, 2013
Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)

"Mobile 3D Graphics SoC: From Algorithm to Chip"
Hoi-Jun Yoo, Jeong-Ho Woo, Ju-Ho Sohn, Byeong-Gyu Nam

English | 2010-03-01 | ISBN: 0470823771 | 342 pages | PDF | 6.2 mb

Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)  eBooks & eLearning

Posted by arundhati at June 5, 2012
Mobile 3D Graphics SoC: From Algorithm to Chip (Repost)

Hoi-Jun Yoo, Jeong-Ho Woo, "Mobile 3D Graphics SoC: From Algorithm to Chip"
2010 | ISBN-10: 0470823771 | PDF | 352 pages | 6,2 MB

Mobile 3D Graphics SoC: From Algorithm to Chip  eBooks & eLearning

Posted by tot167 at Aug. 18, 2010
Mobile 3D Graphics SoC: From Algorithm to Chip

Hoi-Jun Yoo, Jeong-Ho Woo, Ju-Ho Sohn, and Byeong-Gyu Nam, "Mobile 3D Graphics SoC: From Algorithm to Chip"
Wiley | 2010 | ISBN: 0470823771 | 352 pages | PDF | 6,5 MB

Vertical 3D Memory Technologies (repost)  eBooks & eLearning

Posted by arundhati at Dec. 23, 2016
Vertical 3D Memory Technologies (repost)

Betty Prince, "Vertical 3D Memory Technologies"
English | 2014 | ISBN: 1118760514 | 368 pages | PDF | 6 MB

Vertical 3D Memory Technologies  eBooks & eLearning

Posted by Bayron at Sept. 7, 2014
Vertical 3D Memory Technologies

Vertical 3D Memory Technologies by Betty Prince
English | 2014 | ISBN: 1118760514 | 368 pages | PDF | 6,4 MB

Autodesk AutoCAD Plant 3D 2018.1.1  Software

Posted by scutter at Sept. 22, 2017
Autodesk AutoCAD Plant 3D 2018.1.1

Autodesk AutoCAD Plant 3D 2018.1.1 | 3.5 Gb

Autodesk Inc., a world leader in 3D design software for entertainment, natural resources, manufacturing, engineering, construction, and civil infrastructure, announced the release of AutoCAD Plant 3D 2018.1.1. Built on the familiar AutoCAD platform, AutoCAD Plant 3D features specification-driven design and standard parts catalogs to help streamline the placement of piping, equipment, and support structures.